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About usProvider of large-scale manufacturing system solutions, builder of key equipment
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Products & Technology
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This equipment is a pre-annealing cleaning equipment for semiconductor wafers, which adopts a basketless cleaning method to realize pickling, alkali washing, hot water slow lifting and IR (infrared) drying before annealing, and effectively remove impurities on the surface of the wafer before annealing.
This equipment is a pre-test corrosion cleaning process equipment for semiconductor epitaxial wafers, which can realize pre-test corrosion, cleaning, slow lifting and drying of epitaxial wafers.
The system is used in the automatic loading and unloading and transportation of ingot/wafers of wire cutting machines in the semiconductor/photovoltaic industry, including high-altitude conveying systems, cache platforms, loading and unloading robots, etc., replacing the traditional manual loading and unloading operation mode, realizing high-altitude long-distance multi-point transfer of ingot/chips, flexible connection between wire cutting and the front and rear processes, and safe separation of people and logistics.
Address
No.1, Huake Street, Huayuan Industrial Park, Binhai High-tech Zone, Tianjin
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