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About usProvider of large-scale manufacturing system solutions, builder of key equipment
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Products & Technology
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This equipment is a four-probe resistivity detection and sorting equipment for cutting and grinding wafers in the semiconductor polishing wafer production line, which can realize the automatic detection and sorting of resistivity, thickness, and P/N type of multiple specifications of wafers.
This equipment is an automatic pre-cleaning, degumming, cleaning, drying and splitting equipment for semiconductor wafers after wire cutting, including two major parts of degumming, cleaning and splitting machine and resin beam removal line, which can realize the automatic production of silicon wafers from degumming to split into baskets.
This equipment is a four-probe resistivity detection and management system for samples in the semiconductor ingot production line, which can realize the automatic detection and classification management of resistivity, thickness, and P/N type of multi-specification samples, and the sample management is controllable.
This equipment is a semiconductor polished wafer production line oxide film edge removal equipment, which can realize the wafer loading, centering and searching for reference, erosion, cleaning, discharging and other processing processes.
Address
No.1, Huake Street, Huayuan Industrial Park, Binhai High-tech Zone, Tianjin
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