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About usProvider of large-scale manufacturing system solutions, builder of key equipment
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Products & Technology
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This equipment is semiconductor silicon wafer back damage equipment for processing silicon wafers after chemical corrosion. It can realize silicon wafer loading, belt transfer, sand blasting, automatic discharging into basket and other processing.
This equipment is an automatic frame cleaning equipment for semiconductor wafers after wafer milling, and the original frame type dumping can better realize the automatic production of cleaning after wafer milling.
This equipment is a cleaning equipment after polishing the edge of semiconductor wafers, which adopts the method of basketless cleaning to achieve pickling, alkali washing, hot water slow lifting and IR (infrared) drying after wafer edge polishing, effectively removing grinding particles, removing polishing fluid residue, and preventing particle re-adsorption.
This equipment is a semiconductor wafer grinding alkali corrosion equipment, which uses a basket cleaning and drying machine to remove the damage layer after wafer grinding, improve the surface microstructure and clean the surface.
Address
No.1, Huake Street, Huayuan Industrial Park, Binhai High-tech Zone, Tianjin
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