PRODUCT DETAILS

Post Polishing Cleaning Machine


+

Post Polishing Cleaning Machine

Product Introduction

This equipment is a cleaning equipment after polishing the edge of semiconductor wafers, which adopts the method of basketless cleaning to achieve pickling, alkali washing, hot water slow lifting and IR (infrared) drying after wafer edge polishing, effectively removing grinding particles, removing polishing fluid residue, and preventing particle re-adsorption.

Details show


劲旅环境

Product Introduction

This equipment is a cleaning equipment after polishing the edge of semiconductor wafers, which adopts the method of basketless cleaning to achieve pickling, alkali washing, hot water slow lifting and IR (infrared) drying after wafer edge polishing, effectively removing grinding particles, removing polishing fluid residue, and preventing particle re-adsorption.

Related Products


undefined

undefined

Product Equery


%{tishi_zhanwei}%
Tianjin Huanbo Sci&Tech Co., LTD.

scalable manufacturing system solution provider and key equipment manufacturer

Email


Address

No.1, Huake Street, Huayuan Industrial Park, Binhai High-tech Zone, Tianjin

WeChat Public Number
Consulting

Copyright©2023 Tianjin Huanbo Sci&Tech Co., LTD.

Business License