PRODUCT DETAILS

Integrated Wafer Degumming , Splitting and Cleaning Machine


+

Integrated Wafer Degumming , Splitting and Cleaning Machine

Product introduction

It is a PV wafer cleaning equipment, including automatic splitting, loading, cleaning, discharging, and interconnection with sorter.

 

Product Features

Applied to large size 210 silicon wafer cleaning;
Can realize automatic docking with AGV automatic feeding vehicle;
Replacing manual labor to realize automatic loading and unloading of insertion machine magazines;
Utilizing RFID to realize automatic transmission of product data information;
Vertical insertion reduces the rate of large-size wafer fragmentation;
MES system interconnection, automatic data exchange.

Details show


劲旅环境

Product introduction

It is a PV wafer cleaning equipment, including automatic splitting, loading, cleaning, discharging, and interconnection with sorter.

 

Product Features

Applied to large size 210 silicon wafer cleaning;
Can realize automatic docking with AGV automatic feeding vehicle;
Replacing manual labor to realize automatic loading and unloading of insertion machine magazines;
Utilizing RFID to realize automatic transmission of product data information;
Vertical insertion reduces the rate of large-size wafer fragmentation;
MES system interconnection, automatic data exchange.

Product Equery


%{tishi_zhanwei}%
Tianjin Huanbo Sci&Tech Co., LTD.

scalable manufacturing system solution provider and key equipment manufacturer

Email


Address

No.1, Huake Street, Huayuan Industrial Park, Binhai High-tech Zone, Tianjin

WeChat Public Number
Consulting

Copyright©2023 Tianjin Huanbo Sci&Tech Co., LTD.

Business License