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About usProvider of large-scale manufacturing system solutions, builder of key equipment
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Brazil Resin Beam Bonding System
This machine is a material holder & resin beam bonding machine for photovoltaic wafer production. It is mainly used for removing the old resin board from the holder after line cutting and bonding the new resin board automatically.
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Product Description
Products
This machine is a material holder & resin beam bonding machine for photovoltaic wafer production. It is mainly used for removing the old resin board from the holder after line cutting and bonding the new resin board automatically.
Product Features
Interconnection with MES system, automatic data exchange;
Full-automatic production of processes such as boiling, scraping, gluing and curing;
Compatible with a variety of specifications of wire cutting machine material base.
Address
No.1, Huake Street, Huayuan Industrial Park, Binhai High-tech Zone, Tianjin
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