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Laos Post Polishing Cleaning Machine
This equipment is a cleaning equipment after polishing the edge of semiconductor wafers, which adopts the method of basketless cleaning to achieve pickling, alkali washing, hot water slow lifting and IR (infrared) drying after wafer edge polishing, effectively removing grinding particles, removing polishing fluid residue, and preventing particle re-adsorption.
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Product Description
Product Introduction
This equipment is a cleaning equipment after polishing the edge of semiconductor wafers, which adopts the method of basketless cleaning to achieve pickling, alkali washing, hot water slow lifting and IR (infrared) drying after wafer edge polishing, effectively removing grinding particles, removing polishing fluid residue, and preventing particle re-adsorption.
Address
No.1, Huake Street, Huayuan Industrial Park, Binhai High-tech Zone, Tianjin
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