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Putian Semiconductor Wafer Backside Damage Machine
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Product Description
Products
This equipment is semiconductor silicon wafer back damage equipment for processing silicon wafers after chemical corrosion. It can realize silicon wafer loading, belt transfer, sand blasting, automatic discharging into basket and other processing.
Product Features
It can simultaneously meet the processing of a variety of specifications, compatible with 5-inch, 6-inch, 8-inch semiconductor wafer sand blasting processing;
The sand blasting process adopts an adjustable method, and the sand blasting frequency, flow rate and pressure can be adjusted according to the needs of customer's production process;
Adopting dry loading and wet discharging, the silicon wafers realize the transfer of the wafer basket - wafer basket without the need of artificial participation in the intermediate link.
Address
No.1, Huake Street, Huayuan Industrial Park, Binhai High-tech Zone, Tianjin
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