PRODUCTS CENTER
The system is used in the automatic loading and unloading and transportation of ingot/wafers of wire cutting machines in the semiconductor/photovoltaic industry, including high-altitude conveying systems, cache platforms, loading and unloading robots, etc., replacing the traditional manual loading and unloading operation mode, realizing high-altitude long-distance multi-point transfer of ingot/chips, flexible connection between wire cutting and the front and rear processes, and safe separation of people and logistics.
This system is designed and manufactured for the semiconductor substrate factory chamfering process automatic loading and unloading equipment, including the chamfering area before and after the three-dimensional library, air conveyor system, ground rail robot system, etc., to replace the manual loading and unloading mode of operation, and before and after the process of automation, digitalization, information management and control.
The system is designed and made for semiconductor factories wafer three-dimensional library for finished wafer box three-dimensional warehousing, replacing the manual mode of operation, to achieve intelligent in and out of the warehouse, automatic warehousing and other functions, according to the site to achieve automation with the front and rear processes convergence, digitalization, information technology control and management.
The equipment is divided into two specifications: standard type and clean type, which can be applied to the production workshop of the semiconductor gray area and clean area respectively, combined with robot, lifter and other equipment to realize automatic material handling on the ground or in the air.
Address
No.1, Huake Street, Huayuan Industrial Park, Binhai High-tech Zone, Tianjin
Copyright©2023 Tianjin Huanbo Sci&Tech Co., LTD.