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About usProvider of large-scale manufacturing system solutions, builder of key equipment
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Products & Technology
This equipment is an automatic pre-cleaning, degumming, cleaning, drying and splitting equipment for semiconductor wafers after wire cutting, including two major parts of degumming, cleaning and splitting machine and resin beam removal line, which can realize the automatic production of silicon wafers from degumming to split into baskets.
This equipment is a semiconductor polished wafer production line oxide film edge removal equipment, which can realize the wafer loading, centering and searching for reference, erosion, cleaning, discharging and other processing processes.
This equipment is semiconductor silicon wafer back damage equipment for processing silicon wafers after chemical corrosion. It can realize silicon wafer loading, belt transfer, sand blasting, automatic discharging into basket and other processing.
This equipment is an automatic frame cleaning equipment for semiconductor wafers after wafer milling, and the original frame type dumping can better realize the automatic production of cleaning after wafer milling.
Address
No.1, Huake Street, Huayuan Industrial Park, Binhai High-tech Zone, Tianjin
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