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PRODUCT DETAILS
High-Precision Oxide Film Edge Etching Machine
High-Precision Oxide Film Edge Etching Machine
Products
This equipment is a semiconductor polished wafer production line oxide film edge removal equipment, which can realize the wafer loading, centering and searching for reference, erosion, cleaning, discharging and other processing processes.
Product Features
Automatically removes Si02 film from the chamfered and front side of the wafer, reducing processing defects from the epitaxial process;
High precision and speed, including two independent processing lines, can simultaneously meet the processing of products of various specifications, greatly increasing production capacity;
Optional SECS II/GEM communication.
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劲旅环境
Products
This equipment is a semiconductor polished wafer production line oxide film edge removal equipment, which can realize the wafer loading, centering and searching for reference, erosion, cleaning, discharging and other processing processes.
Product Features
Automatically removes Si02 film from the chamfered and front side of the wafer, reducing processing defects from the epitaxial process;
High precision and speed, including two independent processing lines, can simultaneously meet the processing of products of various specifications, greatly increasing production capacity;
Optional SECS II/GEM communication.
Product Equery
Address
No.1, Huake Street, Huayuan Industrial Park, Binhai High-tech Zone, Tianjin
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