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About usProvider of large-scale manufacturing system solutions, builder of key equipment
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Products & Technology
PRODUCT DETAILS
Semiconductor Degumming, Cleaning and Wafer Splitting Integrated Machine
Semiconductor Degumming, Cleaning and Wafer Splitting Integrated Machine
Products
This equipment is an automatic pre-cleaning, degumming, cleaning, drying and splitting equipment for semiconductor wafers after wire cutting, including two major parts of degumming, cleaning and splitting machine and resin beam removal line, which can realize the automatic production of silicon wafers from degumming to split into baskets.
Product Features
Realize the automation of cleaning, degumming, splitting wafers into the basket after wire-cutting silicon wafers, and the automation of water-boiling to remove the resin beam and scraping glue on the surface of the material holder, which saves a lot of labor;
The loading and unloading can be automatically docked with AGV to realize the automatic control of MES system;
Compatible with many kinds of wire cutting machine material holders.
Details show
劲旅环境
Products
This equipment is an automatic pre-cleaning, degumming, cleaning, drying and splitting equipment for semiconductor wafers after wire cutting, including two major parts of degumming, cleaning and splitting machine and resin beam removal line, which can realize the automatic production of silicon wafers from degumming to split into baskets.
Product Features
Realize the automation of cleaning, degumming, splitting wafers into the basket after wire-cutting silicon wafers, and the automation of water-boiling to remove the resin beam and scraping glue on the surface of the material holder, which saves a lot of labor;
The loading and unloading can be automatically docked with AGV to realize the automatic control of MES system;
Compatible with many kinds of wire cutting machine material holders.
Product Equery
Address
No.1, Huake Street, Huayuan Industrial Park, Binhai High-tech Zone, Tianjin
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